By Krishnendu Chakrabarty, Visit Amazon's Philip Y. Paik Page, search results, Learn about Author Central, Philip Y. Paik, , Vamsee K. Pamula
Because of expanding energy intake and part density, localized "hot spots" have gotten a major problem in IC (integrated circuit) chip layout - so severe, in truth, that Intel lately needed to yank a circuit since it was once actually burning. For IC engineers grappling with excessive strength dissipation and thermal matters, new droplet-based cooling options utilizing electronic microfluidics know-how may provide the answer. This definitive consultant paves the way in which, with layout and implementation methodologies and prototypes for using this groundbreaking know-how. After reviewing cooling rules and present bulk cooling tools, the ebook brings engineers in control on rising droplet-based architectures. Amply illustrated, this milestone paintings will turn out priceless in tackling IC warmth matters that present equipment can now not deal with.
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Additional info for Adaptive Cooling of Integrated Circuits Using Digital Microfluidics
Since one side of the TEC is hot, the power on the hot-side must be dissipated by the heat sink. This extra energy may result in higher ambient temperatures at the heat sink, and if the heat sink is not able to dissipate the heat away, the cold side of the TEC could potentially heat up as well. As a result, researchers are finding ways to increase the efficiencies of TEC devices. 5 Microfluidics-Based Cooling Originally proposed in the early 1980s, microfluidic-based cooling devices operate on the premise of pushing small volumes of liquids (<µl volumes) across the surface of an IC in order to conduct and dissipate heat away downstream.
One method is to continually dispense and transport cooled droplets across the surface of an IC, whereby the droplets transfer, store, and carry heat away from the IC substrate to a cooling reservoir. Once the droplet has cooled, it can be redispensed to repeat the cooling process. 11 shows schematic top and Adaptive Hot-Spot Cooling Principles and Design 61 side views of this flow-through cooling method. The system consists of reservoirs of liquid sandwiched between a bottom microfluidic chip and a top plate.
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Adaptive Cooling of Integrated Circuits Using Digital Microfluidics by Krishnendu Chakrabarty, Visit Amazon's Philip Y. Paik Page, search results, Learn about Author Central, Philip Y. Paik, , Vamsee K. Pamula